Multilayer ceramic capacitors series
Manufacturer: avx
The 04023C561 Series is a highly advanced line of surface-mount multilayer ceramic capacitors (MLCCs) engineered for demanding applications requiring exceptional performance and reliability. With a capacitance value of 560 pF and a voltage rating that supports a wide range of operating conditions, this series utilizes high-quality dielectric materials to ensure stable performance across various temperature and voltage ranges. The 04023C561 Series is particularly notable for its X7R dielectric characteristics, which provide a capacitance stability of ±15% over a temperature range of -55°C to +125°C, making it ideal for applications subjected to significant thermal fluctuations.
Designed with a focus on compactness, the 04023C561 Series features a 0402 package size (1.0 mm x 0.5 mm), which is particularly advantageous in contemporary electronic designs where real estate is at a premium. This miniature form factor allows for integration into high-density circuit layouts, including those found in mobile devices, IoT applications, and various consumer electronics. The series is engineered to meet the rigorous demands of modern electronic systems, providing exceptional performance in filtering, decoupling, and energy storage applications.
The versatile nature of the 04023C561 Series makes it suitable for a wide array of industries, including automotive, telecommunications, and industrial automation. In automotive applications, these capacitors can play a crucial role in power supply circuits and signal processing, offering reliability in harsh environments. In telecommunications, they are often employed in RF circuits and base station equipment, ensuring signal integrity and stability. Additionally, their use in industrial automation systems enhances the operational efficiency of sensors and control circuits, contributing to overall system reliability.
Overall, the 04023C561 Series stands out as a reliable choice for engineers seeking high-performance capacitors that can withstand challenging operational conditions while maintaining compact dimensions, making it an essential component in the design of next-generation electronic devices and systems.
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